Wire Bonding Machine
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Semiconductor IC Bonding Equipment/Aluminum Wedge Bonding Machine GR-W01
For New energy power batteries, photovoltaic inverters, automotive electronics, energy storage, IGBT, BMS battery safety control boards, etc；
This wire bonding machine could compatible with aluminum and copper wire bonding;
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Aluminum Wire Bonding Machine for TO Series Wire Bonding -Wedge Bonding ICs/GR-W02
A Single-row TO series special wire bonding machine；
GR-W02 is a wire bonding machine suitable for power devices, the product is compatible with single row to multi-row ultrasonic packaging and design, the bonder is used after a large number of iterative upgrades, using stable and reliable linear motors, voice coil motors, ultrasonic systems for production. In addition, the extended pattern recognition capability of the device provides industry-leading productivity and reliability.
