Semiconductor IC Bonding Equipment/Aluminum Wedge Bonding Machine GR-W01

For New energy power batteries, photovoltaic inverters, automotive electronics, energy storage, IGBT, BMS battery safety control boards, etc；

This wire bonding machine could compatible with aluminum and copper wire bonding;

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Product Detail

Product Tags

Product Feature

●Integrate thick wires and strips in one machine platform with fast system changeover;
●Through the patented welding process control, the welding parameters can be adjusted in real time for the changeable material surface to ensure repeatable welding quality;
●Process transparency through seamless integration in terms of Industry 4.0/OT regulations;
●Achieve the best material matching through a variety of ultrasonic frequencies to choose from, and promote the stability of the process;
●Integration of process technology and automation from a single source of supply.