multi-function high speed Fully multi function automatic dispensing machines

Bonding
Adhesive bonding is a dispensing process used to join two or more parts together. Adhesive bonding processes are becoming increasingly established as a field of application in dispensing technology.
Through the dispensing method bonding, two or more joining partners are joined together. Effective bonding enables a material-to-material bond without introducing heat and causing possible damage to components. Ideally, in the case of plastic parts, activation of the surface takes place by means of atmospheric or low-pressure plasma. During application, the surface and material remain unchanged. Bonding therefore does not affect factors of the component such as mechanics, aerodynamics or aesthetics.
As a rule, the process consists of two steps: First, the adhesive is applied and then the parts are joined. In this process, the adhesive is applied to defined areas on the outside or inside of the component. Crosslinking of the adhesive takes place through material-specific properties. In addition to a variety of industrial sectors such as medical technology, electronics production, lightweight construction, this dispensing process is frequently used in the automotive sector. Adhesive bonding is used, for example, in electronic control units, LiDAR sensors, cameras and many more.

Sealing
The dispensing method sealing is an effective process of protecting components from external influences by creating a barrier.
Sealing is an effective dispensing method for protecting components from external influences by means of a barrier. A usually highly viscous sealing material is applied to the components according to a specified two-dimensional or three-dimensional sealing contour. The most common applications here are the sealing of housings and housing covers. In addition, this method is used to join components together. It is used to eliminate dust, temperature-related influences, moisture, protection of sensitive components and other external influences. In order to achieve the optimum sealing contour, a continuous, precise dispensing application is essential. The dispensing technology of “Green Intelligent” is flexibly designed for the respective required application and the dispensing material.

Potting and vacuum potting
Optimal protection for electronic components is provided by the dispensing process of potting under atmosphere or under vacuum.

The potting of components is chosen to protect sensitive components, eliminate dust, temperature-related influences, moisture or increase service life. The encapsulation of electronics is also one of the applications of this dispensing process. Components are filled or poured with low-viscosity potting materials such as polyurethanes (PU), epoxy resins (epoxy), silicones.
The material preparation should be selected ideally for the potting medium and according to the application.
Typical applications are pacemakers, cable bushings, sensors or electronic components.