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High Precision Green Soldering Machines Automatic System Duplex Laser Solder Ball Welding Machine

Green Intelligent is a national high-tech enterprise focusing on automated assembly and semiconductor equipment.

Green Intelligent focuses on three major fields: 3C electronics, new energy, and semiconductors. At the same time, four companies were established: Green Semiconductor, Green New Energy, Green Robot, and Green Holdings.

Main products: automatic screw locking, automatic high-speed dispensing, automatic soldering, AOI inspection, SPI inspection, selective wave soldering and other equipment; semiconductor equipment: bonding machine (aluminum wire, copper wire).


Product Detail

Product Tags

Device Parameter

tem value
Type Soldering Machine
Condition New
Applicable Industries fuse industry, semiconductor industry, communication industry
Machinery Test Report Provided
Marketing Type Ordinary Product
Warranty of core components 1.5 Years
Core Components PLC, Motor, Pressure vessel
Showroom Location None
Place of Origin China
  Guangdong
Brand Name GREEN
Voltage 220V
Dimensions 100*110*165(cm)
Usage soldering wire
Warranty 3Years
Key Selling Points High-accuracy
Weight (KG) 500KG
Model LAB201
Solder ball specifications 0.15-0.25mm/0.3-0.76mm/0.9-2.0mm(Optional)
Visual positioning system CCD, The resolution±5um
Camera pixels 5 million pixels
Control mode PLC+PC Control
Mechanical repeatability accuracy ±0.02mm
Processing range 200mm*150mm(Customizable)
Use power <2KW/H
Air source Compressed air>0.5 MPa nitrogen>0.5MPa
Outer demension(LW*H) 1000*1100*1650(mm)

Device features

1. The heating and droplet process is fast and can be completed within 0.2s;

2. Complete the melting of the solder ball in the solder nozzle without splashing;

3. no flux, no pollution, to maximize the life of electronic devices;

4. The minimum diameter of the solder ball is 0.15mm, which is in line with the development trendof integration and precision;

5. Welding of different solder joints can be completed through the selection of solder ball size;

6. Stable welding quality and high yield rate;

7. Cooperate with CCD positioning system to meet the needs of assembly line mass production;

8. UPH > 8000 points, yield > 99% (different according to different product )

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Application field

CCM camera/module, gold finger/FPC, wire, communication device, optical device, fuse industry,semiconductor industry solder

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Application Range

Laser solder ball welding realizes precision class: PCB pad and gold finger solder connection, FPC and PCB welding, wire rod and

PCB welding, part THT plug-in device soldering. Products with PIN pins on one side and contralate products with PIN pins on both

sides, and many other precision welding products.

Packing & Delivery

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