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Double Tin Ball Laser Soldering Machine LAB201

After being heated and melted by a laser, the solder balls are ejected from the special nozzle and directly cover the pads. No additional flux or other tools are needed. It is very suitable for processing that requires temperature or soft board connection welding area. During the entire process, the solder joints and the welding body are not in contact, which solves the electrostatic threat caused by contact during the welding process.


Product Detail

Product Tags

Mechanism Specification

Model

LAB201

Laser parameters

Power

150W

Wavelength

1064

Mode

Continuous pulse fiber lasers

Solder ball specifications

0.15-0.25mm/0.3-0.76mm/0.9-2.0mm(Optional)

Visual positioning system

CCD, resolution ± 5 um

Camera pixels

5 million pixels

Control mode

PLC+PC Control

Repeatability accuracy

士0.02mm

Processing range

200mm*150mm(Customized)

Working power

<2KW/H

Air source

Compressed air>0.5 MPa nitrogen > 0.5 MPa

 Outer dimension(L*W*H)

1000*1100*1650(mm)

Weight

500KG

 

Features

1.The heating speed is fast, and the positioning is accurate, which can be completed in 0.2 seconds;

2.The solder balls are ejected from the special nozzle and directly cover the pads.

3.No additional flux or other tools are needed, no pollution generated, maximizing the lifespan of electronic devices;

4.Supporting a minimum diameter of 0.15mm for tin balls, this laser tin ball welding equipment conforms to the development trend of integrated and precision production equipment;

5.Different solder joints can be welded by selecting the size of the solder ball;

6.Stable welding quality and high yield rate;

7.Cooperate with CCD positioning system to meet the needs of large-scale production on assembly lines;

8.UPH ≥ 8000 points, yield ≥ 99% (related to product material and consistency).


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